Presentations

Invited Talks

  1. J. Seo, A Holistic Approach to Optimizing Chemical Mechanical Planarization (CMP) for Enhanced Semiconductor Manufacturing and Sustainability, University of Pittsburgh ECE dept, 2024.
  2. J. Seo, Eco-Innovations in Semiconductor Manufacturing: Sustainable CMP Approaches for the Next Generation, KISM 2024, Korea, 2024.
  3. J. Seo, Tutorial-Navigating the Evolution of CMP from Basics to Breakthroughs, International CMP conf (ICPT), Germany, 2024.
  4. J. Seo, Sustainable Innovations in CMP Slurries From Synthesis Methods to Environmental Impact, The 18th U.S.-Korea Forum on Nanotechnology: Sensors Related to Human Cognition and Sustainability in Semiconductor Manufacturing, AZ, USA, 2024.
  5. J. Seo, Bridging Technology and Environment: Sustainable Approaches in Semiconductor Chemical Mechanical Planarization (CMP), 245th ECS Meeting, USA, 2024.
  6. J. Seo, Chemical Mechanical Planarization, Hanyang University and Kyonggi University, Korea, 2024.
  7. J. Seo, (Plenary Talk) A Holistic Approach to Optimizing Chemical Mechanical Planarization (CMP) for Enhanced Semiconductor Manufacturing and Sustainability, KISM 2023, Korea, 2023.
  8. J. Seo, Research Paradigm Change in CMP at Clarkson University, The 78th CMPUGM 2023, Korea, 2023.
  9. J. Seo, A Holistic Approach to Optimizing Chemical Mechanical Planarization (CMP) for Enhanced Semiconductor Manufacturing and Sustainability, Sungkyunkwan University, Korea, 2023.
  10. J. Seo, A Holistic Approach to Optimizing Chemical Mechanical Planarization (CMP) for Enhanced Semiconductor Manufacturing and Sustainability, Hanyang University, Korea, 2023.
  11. J. Seo, Chemical Mechanical Planarization, The 17th U.S.-Korea Forum on Nanotechnology: Next-Generation Semiconductors and the Environmental Implications of Semiconductor Manufacturing, Korea, 2023.
  12. J. Seo, Environmentally benign post-Chemical Mechanical Planarization (CMP) cleaning solutions, in Sustainable Chemistry in Electronics, 26th Annual Green Chemistry & Engineering Conference, USA, 2022.
  13. J. Seo, Challenges and solutions for post-CMP cleaning at interconnect levels, CAMP Annual Technical Meeting, USA, 2022.
  14. J. Seo, Challenges and solutions for post-CMP cleaning at interconnect levels, SEMICON CHINA & CSTIC, Virtual, 2022.
  15. J. Seo, Shallow Trench Isolation Chemical Mechanical Planarization: slurry chemistry, cleaning chemistry, and mechanisms, SEMICON KOREA, Virtual, 2022.
  16. J. Seo, 3D Trajectories, Diffusion, and Interactions of Single Ceria Particles on a Glass Surface and Their Removal in Post-CMP Applications, 2021 AIChE Meeting, Boston, 2021
  17. J. Seo, CMP Research at Clarkson University, Micron Technology, USA, 2021.
  18. J. Seo, Shallow Trench Isolation Chemical Mechanical Planarization: slurry chemistry, cleaning chemistry, and mechanisms, Hanyang University, Korea, 2021.
  19. J. Seo, Shallow Trench Isolation Chemical Mechanical Planarization: slurry chemistry, cleaning chemistry, and mechanisms, Clarkson University, U.S.A., 2021.
  20. J. Seo, Slurry Engineering for Chemical Mechanical Planarization, ATI Korea, 2017.

Conference Presentations

  1. J. Seo, Direct Observation of Adsorption of Ceria Particles on the Silicon Dioxide Surfaces and Their Removal, 24th International Symposium on CMP, 2021
  2. J. Seo, STI CMP slurry chemistry, 24th International Symposium on CMP, 2021.
  3. J. Seo, Challenges and Solutions for Post-CMP Cleaning of Ceria Particles for Advanced Technology Nodes, 239th ECS meeting with the 18th IMCS, U.S.A., 2021
  4. J. Seo, Direct Observation of Adsorption of Ceria Particles on the Silicon Dioxide Surfaces and Their Removal, 239th ECS meeting with the 18th IMCS, U.S.A., 2021
  5. J. Seo, Cleaning Challenges and Solutions for post STI-CMP cleaning, CAMP 2020 Technical Symposium, U.S.A., 2020.
  6. J. Seo, Post-CMP Cleaning of Cu and Co Surfaces for the Removal of Organic Contaminants for Advanced Interconnect Applications, 23rd International Symposium on CMP, U.S.A., 2019.
  7. J. Seo, Cleaning Challenges and Solutions for FEOL CMP with Ceria slurries, 32nd CAMP Annual Meeting, U.S.A., 2019.
  8. J. Seo, Post-CMP Cleaning of Ceria Particles from Silicon Dioxide and Nitride Wafers for Advanced Technology Nodes, 2018 International Conference on Planarization/CMP Technology, Korea, 2018.
  9. J. Seo, Removal of sub-100 nm Ceria Particles from Silicon Dioxide Surfaces: Challenges and Solutions, 22nd International Symposium on CMP, U.S.A., 2018.
  10. J. Seo, Size-dependent Interactions of Silica Particles with a flat Silica Surface, 22nd International Symposium on CMP, U.S.A., 2018.
  11. J. Seo, Post-CMP Cleaning of Silicon Dioxide Wafers for Advanced Technology Nodes, 31st CAMP Annual Meeting, U.S.A., 2018.
  12. J. Seo, Almost complete removal of sub-90 nm ceria particles from silicon dioxide surfaces, NCCAVS 2018 CMP User Group Spring Meeting, U.S.A., 2018.
  13. J. Seo, A. Gowda, U. Paik, S.V. Babu, Surface chemistry of ceria nanoparticle for CMP applications, 21st International Symposium on CMP, U.S.A., 2017.
  14. J. Seo, J. Moon, K. Kim, K. Lee, S. Yi, U. Paik, Surface chemistry of ceria nanoparticle for CMP applications, ICPT 2016, China, 2016.
  15. J. Seo, J. Moon, U. Paik, Control of localized galvanic corrosion between tungsten and titanium nitride during chemical mechanical planarization, 19th Topical Meeting of the International Society of Electrochemistry, New Zealand, 2016.
  16. J. Seo, K. Kim, K. Lee, Y. Jo, J. Moon, U. Paik, The effect of surface chemistry of ceria nanoparticles varied with synthesis methods on STI CMP, The 11th Pacific Rim Conference of Ceramic Societies, Korea, 2015.
  17. J. Seo, K. Kim, J. Moon, K. Lee, Y. Kim, S. Kim, U. Paik, Poly(acrylic acid)-Poly(ethylene oxide) Complexation for Low Dishing in STI CMP, 2014 International Conference of Planarization/CMP Technology (ICPT 2014), Japan, 2014.
  18. J. Seo, J. Moon, K. Kim, U. Paik, Polishing characteristics of supercritical ceria abrasive for  
  19. J. Seo, J. Moon, K. Kim, Y. Kim, S. Kim, U. Paik, Role of Surface Chemistry of Ceria Nanoparticles in CMP, 225th ECS Meeting, ECS, U.S.A., 2014.
  20. J. Seo, J. Bae, K. Yoon, J. Moon, U. Paik, The effect of Picolinic Acid in Ceria Slurry for Step Height Reduction on CMP, MRS Spring 2012, Materials Research Society, U.S.A., 2012.

Students Awards

  1. H. Tran, TECHCON 2024, Texas, Sep. 2024 (CUGSA Travel Award).
  2. H. Tran, RAPS 2024 Summer, 2024 (Sustainable Award).
  3. A.S. Mofakham, ECS 2024, SFO, May 2024, (First Presentation Award, CUGSA Travel Award).
  4. I. Konstantinou, RAPS 2024 Spring, 2024 (Best Poster Award).
  5. W. Aziz, Department of Chemical & Biomolecular Engineering, Clarkson University, April 2024, (Dr. Lewis J. Derzansky M’68, PhD’73 Memorial Graduate Scholarship Award).
  6. A. Sadrimofakham, 245th ECS Meeting, San Francisco, 2024 (CUGSA Travel Award).
  7. W. Aziz, 18th International Conference on Planarization/CMP Technology, Kanazawa, Japan, 2023 (Best Poster Presentation Award).
  8. H. Tran, 243rd ECS Meeting, Boston, 2023 (CUGSA/ Baltus Travel Award).

Students Presentations

2024

  1. (Oral) Hoang Tran Thi Thuy, Elizabeth J. Podlaha, and Jihoon Seo, The In-situ Electrochemical Characterization of Cu Chemical Mechanical Planarization in the Environmentally Friendly Amino Acid-based Polishing Slurry,  TECHCON Sep. Texas, 2024. 
  2. (Poster) Hoang Tran Thi Thuy, Elizabeth J. Podlaha, and Jihoon Seo, Advanced Oxidation Process for Efficient Treatment of Azole and Amino Acid-Containing Copper CMP Wastewater, TECHCON Sep. Texas, 2024.
  3. (Poster) Irini Konstantinou, Hoang Tran Thi Thuy, Elizabeth J. Podlaha, and Jihoon Seo, Evaluation of amino acids as a Corrosion Inhibitor in the Chemical Mechanical Planarization of Copper and Cobalt Surfaces, TECHCON Sep. 2024, Texas.
  4. (Poster) Chase Larson, Seokgyu Ryu, Elizabeth J. Podlaha, and Jihoon Seo, Approach to Suppressing Complex Corrosion Reactions in Molybdenum investigation into Cysteic Acid as a Molybdenum Chelator for CMPia Amino Acids, TECHCON Sep. 2024, Texas
  5. (Poster) Hoang Tran Thi Thuy, Elizabeth J. Podlaha, and Jihoon Seo, Tribology: Analysis of Amino Acids as Corrosion Inhibitors during Chemical Mechanical Planarization on Cu and Co,  the 26th CAMP CMP conference in Lake-Placid, NY, 2024.
  6. (Oral) Seokgyu Ryu, Elizabeth J. Podlaha, and Jihoon Seo, Advancing Molybdenum CMP: Eco-Friendly Amino Acid Inhibitors and Electrochemical Insights into Corrosion Control, the 26th CAMP CMP conference in Lake-Placid, NY, 2024
  7. (Poster), Ravitej Venkataswamy, Murali Ramu, and Jihoon Seo, Towards Eco-Friendly CMP Processes: Emerging Trends and Strategies for Reducing Environmental Footprint, 26th CMP International Symposium, 2024
  8. (Poster) Charmy Jani, Ravitej Venkataswamy, Shelby Nelson, Jihoon Seo, Sitaraman Krishnan, Chemical Mechanical Planarization (CMP) Process Development for Through Glass Vias, 26th CMP International Symposium, 2024
  9. (Poster) Hoang Tran Thi Thuy, Elizabeth J. Podlaha, and Jihoon Seo, Ease of Decomposition of BTA, L-leucine and L-methionine for Environmentally Benign Cu Chemical Mechanical Planarization Slurries, Clarkson Summer RAPS Research and Project Showcase, 2024.
  10. (Oral) Hoang Tran Thi Thuy, Elizabeth J. Podlaha, and Jihoon Seo, Environmentally Friendly Amino Acid-Based Polishing Slurry with Reduced Galvanic Corrosion at Copper/Cobalt Interface for Advanced Cu Interconnect Applications CMPUG Spring Symposium 2024,  Austin, Texas. 
  11. (Poster) Irini Konstantinou, Hoang Tran Thi Thuy, Elizabeth J. Podlaha, and Jihoon Seo, Analysis of Corrosion Inhibitor Methionine during the Chemical Mechanical Planarization on Cu and Co, Clarkson Spring RAPS Research and Project Showcase, 2024 and the 26th CAMP CMP conference in Lake-Placid, NY, 2024.
  12. (Poster) Murali Ramu, Arunkumar Venkataronappa, Jonas Bankaitis, Jihoon Seo, Polyacrylic Acid-Enhanced Ceria Slurry for Efficient and Sustainable Glass Polishing, 26th CMP International Symposium, 2024
  13. (Oral) Seokgyu Ryu, Kangchun Lee, and Jihoon Seo, Advanced Corrosion Mitigation Strategies in CMP, 2024 CAMP Symposium, Clayton, NY, 2024
  14. (Poster) Chase Larson, Seokgyu Ryu, Elizabeth J. Podlaha, and Jihoon Seo, Approach to Suppressing Complex Corrosion Reactions in Molybdenum via Amino Acids, Clarkson Spring RAPS Research and Project Showcase, 2024.
  15. (Oral), Atefeh Sadri Mofakham, Hanchul Cho, Hyongjae Kim, Goodarz Ahmadi, Jihoon Seo, Insights into Chemical Mechanical Polishing (CMP) performance using Computational Fluid Dynamics (CFD), Seventh Northeast Regional Conference on Complex Systems, Clarkson University, Potsdam, NY, March 2024.
  16. (Oral), Atefeh Sadri Mofakham, Hanchul Cho, Hyongjae Kim, Goodarz Ahmadi, Jihoon Seo, The Influence of Pad Micro-Features on Chemical Mechanical Polishing (CMP) Performance: Insights from Computational Fluid Dynamics (CFD), 245th ECS Meeting, May 26-30, 2024.
  17. (Poster), Atefeh Sadri Mofakham, Goodarz Ahmadi, Jihoon Seo, Investigating Slurry Flow Patterns in Chemical Mechanical Polishing (CMP) Using Computational Fluid Dynamic (CFD) Simulations, 245th ECS Meeting, May 26-30, 2024.
  18. (Poster), Atefeh Sadri Mofakham, Hanchul Cho, Hyongjae Kim, Goodarz Ahmadi, Jihoon Seo, Analyses of the effects of the micropatterned pads on CMP performance using computational fluid dynamics (CFD), Clarkson University’s CAMP Annual Meeting, Clayton, NY, May 2024.
  19. (Poster) Van-Tuan Nguyen, Tomoya Nishi, Satomi Hamada, Hirokuni Himaya, and Jihoon Seo*,  Determination of The Indent Depth of Ceria Embedded During Chemical MechanicalPolishing, Clarkson University’s CAMP Annual Meeting, Clayton, NY, May 2024.
  20. (Poster) Charmy Jani, Ravitej Venkataswamy, Shelby Nelson, Jihoon Seo, Sitaraman Krishnan, Chemical Mechanical Planarization (CMP) Process Development for Through Glass Vias, Clarkson University’s CAMP Annual Meeting, Clayton, NY, May 2024
  21. (Poster) Murali Ramu, Arunkumar Venkataronappa, Jonas Bankaitis, Jihoon Seo, Advancing Glass Polishing Efficiency: Optimizing Ceria Slurry with Polyacrylic Acid for Enhanced Stability and Recyclability, Clarkson University’s CAMP Annual Meeting, Clayton, NY, May 2024

2023

  1. (Oral) S. Ryu, K. Lee, and J. Seo, Advanced Corrosion Mitigation Strategies in CMP From the Bonding Orbital Theory, CMPUGM winter symposium, USA, 2023.
  2. (Oral) O. Chang, J. Seo and T. Kim, Mathematical Modeling of CMP Selectivity for Heterogenous Material films, CMPUGM winter symposium, USA, 2023.
  3. (Oral) W. Aziz, T. Sugioka, K. Date, Y. Fujii, T. Harigae, M. Tsujiwaki, and J. Seo, Surfactant-Mediated Non-Contact Dual Jet Cleaning for Post-CMP Wafer Surface, 18th International Conference on Planarization/CMP Technology, Kanazawa, Japan, 2023. 
  4. (Oral) V.T. Nguyen, J. Wait, T. Nishi, S. Hamada, H. Himaya, J. Seo, Toward Minimizing Ceria-related Defects: An In-depth Analysis of Ceria Removal Models and their Associated Defects during Brush Scrubbing, ICPT, Kanazawa, Japan, 2023.
  5. (Oral) H. Tran, J. Gichovi, J. Commance, E. J. Podlaha, and J. Seo, Environmentally Benign CMP Slurries Aided by Amino Acids, SRC-TECHCON, Texas, 2023.
  6. (Poster) W. Aziz, T. Sugioka, K. Date, Y. Fujii, T. Harigae, M. Tsujiwaki, and J. Seo, Surfactant-Mediated Non-Contact Dual Jet Cleaning for Post-CMP Wafer Surface, 25th CAMP CMP Conference, Lake Placid, NY, 2023.
  7. (Poster) R. Venkataswamy, L. Trimble, A. McDonald, D. Nevers, L. Bengochea, A. Carswell, A. Rossner, and J. Seo, Robust Sustainability Analysis of CMP Consumable Manufacturing, 25th CAMP CMP Conference, Lake Placid, NY, 2023.
  8. (Poster) V. Nguyen, J. Wait, T, Nishi, S. Hamada, H. Hiyama, and J. Seo, Toward Minimizing Ceria-Related Defects: An In-Depth Analysis of Ceria Removal Models and Their Associated Defects During Brush Scrubbing, 25th CAMP CMP Conference, Lake Placid, NY, 2023.
  9. (Poster) H. Tran, J. Gichovi, J. Seo, and E. J. Podlaha, Examining Leucine as an Environmentally Friendly Corrosion Inhibitor for Cu and Co Chemical-Mechanical Planarization (CMP), 25th CAMP CMP Conference, Lake Placid, NY, 2023.
  10. (Poster) A. S. Mofakham, H. Cho, H. Kim, G. Ahmadi and J. Seo, The Influence of Pad Micro-Feature Design on Chemical Mechanical Polishing (CMP) Performance: Insights from Computational Fluid Dynamics (CFD), 25th CAMP CMP Conference, Lake Placid, NY, 2023.
  11. (Poster) A. S. Mofakham, J. Seo, and G. Ahmadi, Application of Computational Fluid Dynamics for Predicting Chemical Mechanical Planarization Performance in Fabrication Processes, 25th CAMP CMP Conference, Lake Placid, NY, 2023.
  12. (2 posters) Atefeh and Ravi, Clarkson RAPS Research and Project Showcase, 2023.
  13. (Poster) J. Gichovi, H. Tran, J. Seo, and E. J. Podlaha, Examining Leucine as an Environmentally Friendly Corrosion Inhibitor for Cu and Co Chemical-Mechanical Planarization (CMP), 25th CAMP CMP Conference, Lake Placid, NY, 2023.
  14. (Poster) Wafi Aziz, Takuo Sugioka, Kazuya Date, Yasushi Fujii, Takako Harigae, Mina Tsujiwaki, and Jihoon Seo, Surfactant-Mediated Non-Contact Dual Jet Cleaning for Post-CMP Wafer Surface, CAMP Annual Technical Meeting, Corning, 2023.
  15. (Poster) R. Venkataswamy, N-T Le, K Park, H. Kang, Sungwon Park, Lyle Trimble, and J. Seo, Towards Understanding Smaller Ceria Particles (< 10 nm) for SiO2 Removal during CMP, CAMP Technical Meeting, Corning, NY, 2023
  16. (Poster) Atefeh Sadri Mofakham, Sunghoon Lee, Jihoon Seo and Goodarz Ahmadi, Novel Micro-fabricated CMP Pads with Controlled Geometries and Micro-features, CAMP Annual Technical Meeting, Corning, 2023.
  17. (Oral) H. Tran, J. Gichovi, E. J. Podlaha, and J. Seo, Environmentally Friendly Amino Acid-Based Polishing Slurry with Reduced Galvanic Corrosion at Copper/Cobalt Interface for Advanced Cu Interconnect Applications, 243rd ECS Meeting, ECS, Boston, 2023.
  18. (Oral) R. Venkataswamy, T. Le, S. Park, L. Trimble, K. Park, H. Kang, and J. Seo, Towards Understanding Smaller Ceria Particles (<10 nm) for SiO2 Removal Rates during Chemical Mechanical Polishing, CMPUG Spring 2023 Symposium, Albany NY, USA 2023.
  19. (Poster) J. Commane, H. Tran, E.J. Podlaha, and J. Seo, Triobology: Electrochemical Reactions In-Situ Chemical Mechanical Planarization, Spring Clarkson RAPS Research and Project Showcase, 2023.
  20. (Poster) V-T. Nguyen,  J. Wait, A.Colak, and J.Seo, Understanding of Ceria particles-SiO2 Surface Adhesion via AFM Colloidal Probe Preparation and Direct Measurement Technique, Spring Clarkson RAPS Research and Project Showcase, 2023.
  21. (Poster) A. Sadri Mofakham, G. Ahmadi, J. Seo,  Computational Fluid Dynamic Simulations of Slurry and Abrasive Flows during CMP using Advanced Pads with Controlled Micro-features, Summer Clarkson RAPS Research and Project Showcase, 2023.
  22. (Oral) R. Venkataswamy, L. Trimble, A. McDonald, D. Nevers, L. V. Bengochea, A. Carswell, A. Rossner, and J. Seo, Robust Sustainability Analysis of CMP Consumable Manufacturing, Summer Clarkson RAPS Research and Project Showcase, 2023.
  23. (Poster) R. Venkataswamy, S. Park, L. Trimble, J. Seo, S.V. Babu, Investigation of Silicon Dioxide Removal Mechanisms Using Ceria Particles Down to 10 nm, Spring Clarkson RAPS Research and Project Showcase, 2023.
  24. (Poster) W. Aziz, J. Seo, Non-contact Dual Jet Cleaning Technique for Post-CMP Cleaning Applications, Spring Clarkson RAPS Research and Project Showcase, 2023.
  25. (Oral) H. Tran, Juster Gichovi, Julia Commane, E.J. Paducah, and J. Seo, Environmentally-friendly Polishing Slurry containing Amino Acids for Advanced Cu Interconnect Applications, Spring Clarkson RAPS Research and Project Showcase, 2023.

~2022

  1. (Poster) H. Tran, J. Gichovi, I. Morrow, E. J. Podlaha, and J. Seo, Environmentally benign CMP slurries aided by amino acids, ICPT 2022, ICPT 2022, Portland, 2022.
  2. (Poster) R. Venkataswamy, T. Le, K. Park, H. Kang, and J. Seo, Towards understanding smaller ceria particles (<10 nm) for SiO2 Removal Rates during CMP, ICPT 2022, Portland, 2022.
  3. (Poster) S.S.R.K. H. Vegi, J. Seo, S.V. Babu, Effect of chain length and the number of functional groups in amines on post-CMP cleaning of Co-BTA complexes Particles for Advanced Technology Nodes, 24th International Symposium on CMP, 2021.