CAMP is excited to host the 25th International Symposium on Chemical-Mechanical Planarization (CMP)
August 6 - 9, 2023 in Lake Placid, NY
Chemical-mechanical planarization (CMP) has come to occupy a central role in many industrially important technologies.
You are cordially invited to attend the 25th International Symposium on CMP hosted by Clarkson University’s Center for Advanced Materials Processing (CAMP).
The meeting will again be held in picturesque Lake Placid, New York. It will provide ample opportunities to hear leading-edge ideas and technologies relating to CMP and to network with colleagues in the CMP field.
Dates: Sunday August 6 – Wednesday August 9, 2023
Location: High Peaks Resort Hotel, Lake Placid, NY, USA. (Visit their website)
The symposium will consist of talks given by experts in the field (invite only) and contributed scientific posters.
Keynote and plenary speakers to be announced soon!
Sunday August 6 (afternoon/evening): Registration and welcome reception (no dinner provided)
Monday August 7 (morning): Presentations by invited speakers
Monday August 7 (afternoon): Networking time and poster presentations
Monday August 7 (evening): Dinner & keynote lecture
Tuesday August 8 (morning): Presentations by invited speakers
Tuesday August 8 (afternoon): Networking time and poster presentations
Tuesday August 8 (evening): Dinner & keynote lecture
Wednesday August 9 (morning): Presentations by invited speakers
Wednesday August 9 (lunch/afternoon): Depart
(agenda subject to change; updates to occur as speakers and other information is confirmed)
Registration & Accommodation Information
A completed tax-exempt form must be presented for tax-exempt status.