Research

Research Interests

  • Research and development of new CMP slurries and Post-CMP cleaning solutions for copper, tungsten, cobalt, oxide, STI, and barrier metal layers.
  • Colloidal Chemistry and Electrochemistry
  • Nanoparticle synthesis and dispersion
  • Particle adhesion and removal
  • Atomic force microscopy & Evanescent Wave Microscopy

Chemical Mechanical Planarization, CMP process

Working at Our Lab

Chemical Mechanical Planarization