Research Interests
- Research and development of new CMP slurries and Post-CMP cleaning solutions for copper, tungsten, cobalt, oxide, STI, and barrier metal layers.
- Colloidal Chemistry and Electrochemistry
- Nanoparticle synthesis and dispersion
- Particle adhesion and removal
- Atomic force microscopy & Evanescent Wave Microscopy
Chemical Mechanical Planarization, CMP process
Working at Our Lab
Chemical Mechanical Planarization
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