Clarkson University’s Center for Advanced Materials Processing (CAMP) will host the 26th International Symposium on Chemical Mechanical Planarization (CMP) in Lake Placid, NY, from August 11 – 14, 2024.
Chemical-mechanical planarization (CMP) plays a central role in many industrially important technologies, especially in semiconductor manufacturing. The 26th International Symposium on CMP will be a leading forum to hear leading-edge ideas and technologies relating to CMP along with ample time to network with colleagues in the CMP field. Presentations are by invitation only which ensures a very high-quality meeting.
Plan to join us in Lake Placid in August!
Keynote & Plenary Speakers Announced!
We are pleased to announce that the symposium will feature the following special guest speakers:
Vidya Krishnan
Vice President of Global Operations at GlobalFoundries
Keynote Speaker during conference dinner (Aug. 13)
Ji-Chul Yang
General Manager & Head of R&D at EBARA Corp.
Plenary Speaker
“Images of the Planarization Process in Semiconductor Devices in 2030”
Brown Peethala
Senior Manager, CMP Process at IBM
Plenary Speaker
“Process Innovations for Advanced Logic Technology”
*** Draft Schedule Now Available ***
The draft schedule for the 2024 CAMP CMP Symposium is now available.
Please note this is a draft (as of 28 June, 2024) and subject to change.
Please contact Leila Boyea if you need the agenda emailed to you.
The symposium will be held at the High Peaks Resort in Lake Placid.
Check this website regularly for updates.
Contact the CAMP office if you have any questions:
Telephone: +1-315-268-2336
Email: camp@clarkson.edu
Registration:
Regular Attendee: $900
Invited Speakers: $650
Students: $250
Registration includes breakfasts, lunches, and symposium dinner on Tuesday night (Aug 13), but not hotel accommodation or dinners on Sunday (Aug 11) or Monday (Aug 12) nights – please enjoy the restaurants along Lake Placid’s main street.
Hotel & Accommodation
The location of the symposium will be the High Peaks Resort, and while we do have a block of rooms reserved at the High Peaks, you are welcome to look for other accommodations in Lake Placid (there are quite a few hotels, B&Bs, etc., to choose from – use your favorite search engine or check out this website for ideas).
To reserve a room at the High Peaks Resort you must call +1-518-523-4411. (You can check out their website here, but unfortunately, they do not do over-the-web reservations).
Room rate is $289 per night. Reference: Clarkson University CMP
Please email Leila (lboyea@clarkson.edu) if you have any difficulties getting through to the hotel. The cut-off date for our block has been extended to July 18, 2024.
Confirmed Invited Speakers Include:
Uma Rames Krishna Lagudu (3M)
“Pad Conditioning Solutions for Improved Pad Life and Defectivity”
Kangchun Lee (Kyonggi University)
“Predicting Corrosion Inhibition Efficiency Based on Charge Transfer Factor”
Leticia Vazquez Bengochea (Micron)
“How CMP Will Enable and Accelerate the Advanced Memory Roadmap”
Syuhei Kurokawa (Kyushu University)
“Observation of slurry particle behavior at the polishing pad-wafer contact interface and proposal of a new pad-wafer contact model for understanding CMP mechanism”
Norikazu Suzuki (Chuo University)
“Towards an Advanced Process Control of Chemical Mechanical Polishing Utilizing Physical Model-based Digital Twin”
Yohei Hashimoto (Kanazawa University)
“Analysis of Material Removal Rate Distribution in Oxide CMP Process Using Stop-polishing Approach”
Hideo Aida (Nagaoka Univ. of Technology)
“Development of Plasma-CMP Technique for Hard-to-process Semiconductor Materials”
Yasuhiro Kawase (Mitsubishi Chemical Corp.)
“Semiconductor Cleaning: Fundamentals and Technology Trends in Post-CMP Cleaning”
Seokgyu Ryu (Clarkson University)
“Advancing Molybdenum CMP: Understanding Inhibition Mechanism of Environmentally Friendly Amino Acids via Passivation Layer Analysis”
John Matovu (Micron)
“Challenges and Opportunities of Using Engineered High Oxide Rate Slurries (HORS) for Scratch Reduction and Removal Rate Improvement”
Jakub Nalaskowski (NYCREATES)
“Chemical Mechanical Planarization for Superconducting Quantum Devices Development”
Seunghoon Choi (Samsung)
“Tailored Electrostatic Attraction Force Between Anionic Polymer and Si3N4 Film in Consecutive Gate Poly Open CMP”
Myunggoo Lee (KCTech)
“Surface chemistry of Ceria for CMP”
Ravi Palaparthi (DuPont)
“Wafer Edge Profile and Control during CMP”
Yi Guo (DuPont)
“Exploration of Tungsten and MOL Slurry Building-Blocks for Advanced Node CMP Processes”
Pinlei Chu (IBM)
“Tungsten dissolution in MOL-Root Cause Investigation”
Dan Troolin (TSI)
“High-Resolution Size Distribution Characterization of CMP Slurry Particles”
Badri Bhattarai (EMD Group)
“Copper CMP Slurry Development for Advanced Technology Nodes”
Hanchul Cho, Doyeon Kim, Taekyung Lee, Hyoungjae Kim (Korea Institute of Industrial Technology)
“Breaking Boundaries: Recipe-Free Innovation in CMP Pad Conditioning”
Cetin Cetinkaya (Clarkson University)
“TBA”
Atanu Das (Entegris)
“Integrated Approaches of Designing Better PCMP Cleaning Formulations”
Taesung Kim (SKKU)
“Investigation of Thermal Effects in Chemical Mechanical Planarization (CMP)”
Christoper Netzband (TEL)
“Planarization Challenges for Current and Future 3D Integration Technologies”
Rob Rhoades (XTrinSiC)
“Methods for Characterizing Slurry Health and Why it Matters”
Francois Laforge (Horiba)
“TBA”
Please note that oral presentations are by invitation only.
Master Schedule
Below is an outline of the symposium schedule. The detailed schedule will be announced in July.
Each Session will consist of 4-5 talks (most 25 mins except the two plenaries and the keynote). Topics include: CMP Applications, CMP Pads and Conditioners, CMP Slurries, Post-CMP Cleaning, Advances in CMP Tools, CMP of Novel Materials.
SUNDAY, AUGUST 11
1:00 pm – 5:00 pm Registration & Hotel Check-In (Hotel Lobby)
5:00 pm – 6:00 pm Welcome Reception (Sentinel Range)
MONDAY, AUGUST 12 All presentations will be held in McIntyre Range
7:00 am – 8:00 am Breakfast (Great Range)
8:00 am – 9:50 am SESSION A: (Includes Plenary Speaker 1)
9:50 am – 10:15 am Break (25 min)
10:15 am – 12:00 am SESSION B:
12:00 pm – 1:30 pm Lunch (Great Range)
1:30 pm – 4:00 pm Open Time
4:00 pm – 5:30 pm SESSION C:
5:40 pm – 7:00 pm Poster Session and Reception (Sentinel Range)
7:00 pm – late Dinner on your own. There are many excellent restaurants in Lake Placid to choose from.
TUESDAY, AUGUST 13
7:00 am – 8:10 am Breakfast Buffet (Great Range)
8:10 am – 9:50 am SESSION D: (Includes Plenary Speaker 2)
9:50 am – 10:15 am Break (25 min)
10:15 am – 12:00 pm SESSION E: Title
12:00 pm – 1:30 pm Lunch (Great Range)
1:30 pm – 4:00 pm Open Time
2:00 pm – 4:00 pm Mentoring Workshop for Students (optional)
4:00 pm – 5:40 pm SESSION F:
5:40 pm – 6:30 pm Reception (Sentinel Range)
6:30 pm – 8:30 pm 2024 International CMP Symposium: Dinner & Keynote Address (Great Range).
Vidya Krishnan, VP for Global Operations, GlobalFoundries.
WEDNESDAY, AUGUST 14
7:00 am – 8:30 am Breakfast Buffet
SESSION G: Session Title
8:10 am – 9:50 am SESSION G:
9:50 am – 10:15 am Break (25 min)
10:15 am – 12:00 pm SESSION H:
12:00 pm – 1:30 pm Lunch (Great Range) & Depart
Note: The schedule is draft only and may change.
Call For Student Posters
We invite students to submit poster abstracts for the 26th International Symposium on Chemical-Mechanical Planarization.
The goal of the poster session is to provide an opportunity to network, learn about each other’s work and interests, and meet academic and industrial colleagues for future collaborative research.
Submission Guidelines
Abstracts should be about 200 words, written in English, and can include 1 figure or table. All submitted abstracts will be reviewed by the Technical Committee.
Please submit your abstract to: https://forms.gle/17VsvnkyHBWaTeNR9
Important Dates
July 16, 2024: Abstract submission closes at 11:59 PM EDT
How to get to Lake Placid?
The following website has information on how to get to Lake Placid:
(https://www.lakeplacid.com/explore/getting-here)
While there is a small regional airport close by that has flights to/from Boston, planes are small and can be bumpy 🙁
The closest international airport is Albany NY (the NY State capitol). If you choose to fly into Albany, rent a car and then enjoy the 2.5 hour drive through the picturesque Adirondacks.