2025 CAMP CMP Symposium

CAMP and the NCCAVS CMP Users Group are excited to co-host the 27th International Symposium on Chemical-Mechanical Planarization (CMP)!

The meeting will be held July 27 – 30, 2025, in Saratoga Springs, NY. Saratoga Springs is a beautiful upstate NY town only 45 mins drive from Albany International airport.

Chemical-mechanical planarization (CMP) has come to occupy a central role in many industrially important technologies, especially in semiconductor manufacturing. The 27th International Symposium on CMP, hosted by Clarkson University’s Center for Advanced Materials Processing (CAMP) in conjunction with the US CMP Users Group, is the leading forum to hear leading-edge ideas and technologies relating to CMP along with ample time to network with colleagues in the CMP field.

** Final Presentation Schedule & Abstract Booklet Now Available **

NEW (July 23): Final presentation schedule now available here!

The full symposium booklet (with abstracts) can be found here (you are welcome to download it).


Keynote Speaker

Mark Dougherty

President & General Manager, Tokyo Electron America, and TEL Manufacturing & Engineerings of America, members of the Tokyo Electron Limited (TEL) group of companies.

Mark is responsible for all TEL U.S. customer sales and service support, as well as U.S.-based semiconductor process equipment development and manufacturing. Prior to joining TEL in April 2020, he was Vice President of Module Engineering and Manufacturing Operations at GlobalFoundries Fab 8, where he led a tenfold increase in manufacturing capacity, ramping production volume and yield to world-class levels. Mark spent over 20 years in IBM’s semiconductor unit, working as a process and integration engineer before assuming progressively larger management responsibilities in module engineering, process control, manufacturing operations, and unit process development.

Plenary Speakers

Dr. Bahar Basim

Engineering Manager (Planar and DE Productivity) & Program Lead, Intel Corp.

With over two decades of experience in microelectronics research and development, integration, and yield enhancement, Dr. Basim is a recognized expert in her field. She has held significant roles at Intel Corporation and Texas Instruments and multiple academic appointments. At Intel Corporation, Dr. Basim worked on 3-D NAND development with the Non-Volatile Memory Scaling and Architecture Group. She is currently part of the Logic Technology Development Productivity and Selection Team, focusing on first-of-a-kind equipment, materials cost, and new technology introduction.

Dr. Paul Bernatis

Fellow, DuPont Advanced Cleans & Slurry Technologies

With considerable experience in nanoparticles and surfaces gained from decades of working in the semiconductor and pharmaceutical industries, Dr. Bernatis is a leader in developing formulations used for cleaning applications. His work at DuPont requires the development of selective chemistries to remove tenacious residues from delicate structures. Most recently, his focus has been on developing new formulations for post-CMP cleaning of cutting-edge devices with sub-10 nm geometries that contain corrosion-sensitive metals.


Registration & Hotel Information:

Symposium site:

Gideon Putnam Hotel, Saratoga Springs, NY.

Registration is Closed!

Registration rates listed below include symposium attendance, breakfasts and lunches (Monday-Wednesday), receptions on Sunday and Monday, and the symposium dinner (on Monday, July 28). Hotel rooms are to be paid separately.

Full Registration: $900
Speaker Registration: $650
ClarksonU Faculty/Staff Registration: $650
Student Registration: $250

Registration closed July 14, 2025 (11:59pm U.S. EST).

The registration refund policy is at the bottom of the page.

Hotel accommodation details:

Gideon Putnam Resort Check-In Time: 4 pm

Gideon Putnam Resort Check-Out Time: 11am

Block reservations at the Gideon Putnam are no longer available, but you may still contact the Gideon Putnam directly to check if rooms are available. The same applies to the second hotel, Home2 Suites by Hilton, in nearby Malta, NY (approx. 7 miles from the Gideon).

There are many other hotels in Saratoga Springs to consider. Please note, however, these may be 1-2 miles from the Gideon Putnam Hotel, so you will need to plan for travel to/from the Gideon Putnam.

About Saratoga Springs:

Saratoga Springs is in picturesque upstate New York and has a lot of things to see and do. The Adirondack Mountains are only a short drive away and Saratoga Springs is internationally known for its horse racing.

Check out more about Saratoga Springs here.

Please reach out to Leila Boyea at the CAMP office (lboyea@clarkson.edu), CAMP Director Devon Shipp (dshipp@clarkson.edu), or CAMP Business Development Director Eric Xu (ericxu@clarkson.edu) if you have questions.

Eating & Entertainment in the Saratoga Springs area

Saratoga Springs has a lot to see and do!

Check out www.discoversaratoga.org for specific info, but consider diving into Saratoga’s history (e.g., Revolutionary War Monument), horse racing (e.g., National Museum of Racing and Hall of Fame), beautiful parks (e.g., Saratoga Spa State Park), and golf courses. Much more can be found at the Discover Saratoga website.

Below are some local restaurants (with phone numbers and opening days during our symposium), but there are many others.

  • The Bunker Saratoga Springs   (518-245-6480)
  • Old Bryan Inn    (518-587-2990) (open Sunday, closed Monday/Tuesday)
  • 15 Church    (518-587-1515)
  • Max London’s    (518-587-0505)
  • Brasserie Benelux    (518-682-6950) (open Sunday/Tuesday, closed Monday)
  • Osteria Danny    (518-709-5221)
  • Morrissey’s Lounge & Bistro    (518-350-7945)

Searching online is an option, of course, or check out www.discoversaratoga.org for other info.


Poster Session

The goal of the poster session is to provide an opportunity to network, learn about each other’s work and interests, and meet academic and industrial colleagues for future collaborative research. A list of the posters (titles, authors, presenters) can be found here.

Posters will be presented on Monday, July 28, from 5:40 – 7:00 pm in the Gallery


Confirmed Invited Speakers

FINAL Schedule of presentations now availableHERE

Speaker NameAffiliation Title 
Dougherty, Mark TEL AmericaKeynote: The Dual Challenge: Addressing Technology Inflections & Sustainability Simultaneously
Basim, Bahar Intel Corporation Plenary: Microelectronics Manufacturing: A vision towards the future of CMP as an enabler 
Bernatis, Paul DuPontPlenary: Enabling Sub 3 nm Transistor Miniaturization and Multilayer Z Stacking with CMP Consumables Innovation
Afekare, Dayo DuPont Tribo-Electrochemical Phenomena at Cu CMP & PCMP Interfaces: Enabling Performance Prediction and Technology Differentiation
Dhillon, Pritpal EMD USAdaptive Ultra-High Copper Polish Removal Rate Slurries for Cutting-Edge Semiconductor Nodes
Fukuda, AkiraTokuyama KOSENSimulation for Material Removal Rate Distribution using Slurry Polishing Ability
G. V., Arunkumar (Arun) IBMPost-CMP Cleaning of Poly and Post-grind Amorphous Silicon for Wafer Bonding Applications
Gottfried, KnutErzM-Technologies/Fraunhofer ENASCMP and Surface Processing in Heterogeneous Integration
Kanno, Masahiro ResonacAbrasive-Free Polymer CMP Technology Developed for Advanced Packaging
Kelly, JimIBMAdvancement of Si wafer backside thinning technology and its applications
Keleher, Jason Lewis University From Contact to Clean: Engineering Molecular Interactions for Interfacial Stress-Optimized Chemical Mechanical Planarization Processes 
Kim, HojoongMicronRecent Updates in the DRAM CMP Development
Kim, TaesungSKKUA Study on Eco-Friendly CMP Metal Slurries: Green Biocide Strategies for Copper Microbial Control and Iron-Complex Catalysts for Enhanced Tungsten Planarization
Krishnan, SitaramanClarkson UniversityMechanistic and Electrochemical Reevaluation of Chelator, Inhibitor, and Oxidant Roles in High-Rate Copper CMP
Lee, Jae-dong KCTechStudy on CMP Solutions Which Enable to Realize Advanced Packaging Process
Lim, Jongheun (JH)EBARACollaborative Development of CMP Technologies and Consumables Ecosystem
Nukuna, Nagella DuPont Electronics Corporation DuPont’s holistic approach in advancing CMP/PCMP technology
Philipossian, Ara Araca and 3M Tribological, Thermal, Kinetic, and Surface Microtextural Characterization of Prime p-Type <100> Silicon Wafer CMP using Advanced Microreplicated Pads for Direct Wafer Bonding Application
Philipossian, Ara AracaBenefits of Novel Megasonic Slurry Activation in Copper CMP
Rudolph, Catharina Fraunhofer IZM-ASSIDEnabling advanced direct bond interconnection with CMP: From R&D to HVM implementation
Sanada, Toshiyuki Shizuoka UniversityDeformation of PVA Brush Nodules and the Resulting Liquid Flow in Post-CMP Cleaning
Seo, Jihoon Clarkson UniversityGreen Chemistry Solutions for Metal Corrosion Control in Advanced Semiconductor Manufacturing
Simpson, Alexander 3MDeveloping CMP Pads for Next-Generation Nodes
Suzuki, Keisuke Kyushu Institute of TechnologyStudy on the Removal Method of Nanoparticles Using Cleaning-Assisted Resin Particles
Uneda, MichioGifu UniversityStudy on the Removal Method of Nanoparticles Using Cleaning-Assisted Resin Particles
Wedlake, Michael IBMPad Groove Monitoring: A Path Towards Improved Process Control, Lower Costs, and Higher Yield
Zhang, Baoguo Hebei University of Technology Explore the Roles and Mechanisms of Green Organic Additives in GaN CMP
Zhang, Brian Applied MaterialsModeling of Fluid Dynamics in CMP

(note that oral papers are invitation only)


2025 CAMP CMP Symposium Sponsors

We are grateful to the following sponsors!

Platinum sponsors

Gold sponsors

If your organization is interested in becoming a sponsor, please contact CAMP’s Business Development Director, Eric Xu, at zxu@clarkson.edu.


Registration Refund Policy

Full refund if request is made to the CAMP office by 11:59 pm (US EST) on July 11, 2025. 33% refund if request is made from July 12 – 26, 2025. No refund after July 26, 2025. Hotel payments/refunds are only handled between the attendee and the hotel.


Find out more about CAMP at our main website: https://www.clarkson.edu/academics/research/labs-centers/camp

Find out more NYSTAR’s Centers of Advanced Technologies (CATs): https://esd.ny.gov/doing-business-ny/centers-advanced-technology

To learn more about the Northern California Chapter of the American Vacuum Society (NCCAVS) CMP Users Group, visit: https://nccavs-usergroups.avs.org/about_cmpug/

CAMP - Center for Advanced Materials Processing logo
New York State of Opportunity - Division of Science, Technology & Innovation. Division of Empire State Development