CAMP and the NCCAVS CMP Users Group are excited to co-host the 27th International Symposium on Chemical-Mechanical Planarization (CMP)!
The meeting will be held July 27 – 30, 2025, in Saratoga Springs, NY. Saratoga Springs is a beautiful upstate NY town only 45 mins drive from Albany International airport.
Chemical-mechanical planarization (CMP) has come to occupy a central role in many industrially important technologies, especially in semiconductor manufacturing. The 27th International Symposium on CMP, hosted by Clarkson University’s Center for Advanced Materials Processing (CAMP) in conjunction with the US CMP Users Group, is the leading forum to hear leading-edge ideas and technologies relating to CMP along with ample time to network with colleagues in the CMP field.
We will have an exciting line-up of speakers, keynotes, and plenaries – approximately 30 in total – please check below for updates!
Keynote Speaker
Mark Dougherty
President & General Manager, Tokyo Electron America, and TEL Manufacturing & Engineerings of America, members of the Tokyo Electron Limited (TEL) group of companies.
Mark is responsible for all TEL U.S. customer sales and service support, as well as U.S.-based semiconductor process equipment development and manufacturing. Prior to joining TEL in April 2020, he was Vice President of Module Engineering and Manufacturing Operations at GlobalFoundries Fab 8, where he led a tenfold increase in manufacturing capacity, ramping production volume and yield to world-class levels. Mark spent over 20 years in IBM’s semiconductor unit, working as a process and integration engineer before assuming progressively larger management responsibilities in module engineering, process control, manufacturing operations, and unit process development.
Plenary Speakers
Dr. Bahar Basim
Engineering Manager (Planar and DE Productivity) & Program Lead, Intel Corp.
With over two decades of experience in microelectronics research and development, integration, and yield enhancement, Dr. Basim is a recognized expert in her field. She has held significant roles at Intel Corporation and Texas Instruments and multiple academic appointments. At Intel Corporation, Dr. Basim worked on 3-D NAND development with the Non-Volatile Memory Scaling and Architecture Group. She is currently part of the Logic Technology Development Productivity and Selection Team, focusing on first-of-a-kind equipment, materials cost, and new technology introduction.
Dr. Paul Bernatis
Fellow, DuPont Advanced Cleans & Slurry Technologies
With considerable experience in nanoparticles and surfaces gained from decades of working in the semiconductor and pharmaceutical industries, Dr. Bernatis is a leader in developing formulations used for cleaning applications. His work at DuPont requires the development of selective chemistries to remove tenacious residues from delicate structures. Most recently, his focus has been on developing new formulations for post-CMP cleaning of cutting-edge devices with sub-10 nm geometries that contain corrosion-sensitive metals.
Registration & Hotel Information:
Symposium site:
Gideon Putnam Hotel, Saratoga Springs, NY.
Registration is Open!
Registration rates listed below include symposium attendance, breakfasts and lunches (Monday-Wednesday), receptions on Sunday and Monday, and the symposium dinner (on Monday, July 28). Hotel rooms are to be paid separately.
Full Registration: $900
Speaker Registration: $650
ClarksonU Faculty/Staff Registration: $650
Student Registration: $250
Registration closes July 14, 2025 (11:59pm U.S. EST).
The registration refund policy is at the bottom of the page.
Hotel accommodation details:
The Gideon Putnam is offering a discount rate of $249/night for the CAMP CMP Symposium attendees. Please make your hotel reservations via this website.
(Note: If you navigate separately to the Gideon Putnam website, you may receive a “We are closed” message….this is only because CAMP has a block reservation in place. To overcome this, make sure to select CODE TYPE: GROUP and then put in Code: KGN72725ISCMP).
There are many other hotels in Saratoga Springs to consider. Please note, however, these may be 1-2 miles from the Gideon Putnam Hotel so you will need to plan for travel to/from the Gideon Putnam.
About Saratoga Springs:
Saratoga Springs is in picturesque upstate New York and has a lot of things to see and do. The Adirondack Mountains are only a short drive away and Saratoga Springs is internationally known for its horse racing.
Check out more about Saratoga Springs here.
Please reach out to Leila Boyea at the CAMP office (lboyea@clarkson.edu), CAMP Director Devon Shipp (dshipp@clarkson.edu), or CAMP Business Development Director Eric Xu (ericxu@clarkson.edu) if you have questions.
Call for posters
The goal of the poster session is to provide an opportunity to network, learn about each other’s work and interests, and meet academic and industrial colleagues for future collaborative research.
Abstracts for posters are requested on the following topics:
- Particle and colloidal aspects
- Slurry development and metrology
- Pad/ conditioning behaviors
- CMP of ….
- STI, SiN, polysilicon, etc.
- W, Cu, Co, etc.
- Substrate materials (e.g., SiC, Si, GaN, InP, Al2O3, glass, etc.)
- Alternate thin films (e.g., noble metals, polymers, etc.)
- CMP of III/V metals and new barrier materials
- CMP fundamental science and technology
- Defects and post-CMP cleaning
- Low-k films and integration issues
- Micro LEDs / MEMS / SOI polishing
- Other emerging applications of CMP
Submission Guidelines:
Abstracts should up to 1 page, be about 200-300 words, written in English, and can include 1 figure or table. All submitted abstracts will be reviewed by the Technical Committee. Deadline for submission is June 30, 2025(11:59 US EDT).
Submit abstracts here:
Confirmed Invited Speakers
| Speaker Name | Affiliation | Presentation Title |
| Dougherty, Mark | TEL America | KEYNOTE: The Dual Challenge: Addressing Technology Inflections & Sustainability Simultaneously |
| Basim, Bahar | Intel Corporation | PLENARY: Microelectronics Manufacturing: A Vision Towards the Future of CMP as an Enabler |
| Bernatis, Paul | DuPont | PLENARY: Enabling Sub-3 nm Transistor Miniaturization and Multilayer Z Stacking with CMP Consumables Innovation |
| Afekare, Dayo | DuPont | Tribo-Electrochemical Phenomena at Cu CMP & PCMP Interfaces: Enabling Performance Prediction and Technology Differentiation |
| Dhillon, Pritpal | EMD US | Adaptive Ultra-High Copper Polish Removal Rate Slurries for Cutting-Edge Semiconductor Nodes |
| Fukuda, Akira | Tokuyama College | Simulation for Material Removal Rate Distribution using Slurry Polishing Ability |
| G. V., Arunkumar (Arun) | IBM | Post-CMP Cleaning of Poly and Post-grind Amorphous Silicon for Wafer Bonding Applications |
| Gadkari, Gaurang | IBM | Process setup and improvement for MOL Dielectric CMP process |
| Gottfried, Knut | ErzM-Technologies/Fraunhofer ENAS | CMP and Surface Processing in Heterogeneous Integration |
| Kanno, Masahiro | Resonac | Abrasive Free Polymer CMP Technology Developed for Advanced Packaging |
| Kasai, Toshi | IBM | Recent Advancement of Si Wafer Back Side Thinning and the Applications |
| Keleher, Jason | Lewis University | From Contact to Clean: Engineering Molecular Interactions for Interfacial Stress-Optimized Chemical Mechanical Planarization Processes |
| Kim, Hojoong | Micron | Recent Updates in the DRAM CMP Development |
| Kim, Taesung | SKKU | A Study on Eco-Friendly CMP Metal Slurries: Green Biocide Strategies for Copper Microbial Control and Iron-Complex Catalysts for Enhanced Tungsten Planarization |
| Krishnan, Sitaraman | Clarkson University | Mechanistic and Electrochemical Reevaluation of Chelator, Inhibitor, and Oxidant Roles in High-Rate Copper CMP |
| Lee, Jae-dong | KCTech | Study on CMP Solutions Which Enable to Realize Advanced Packaging Process |
| Lim, Jongheun (JH) | EBARA | Collaborative Development of CMP Technologies and Consumables Ecosystem |
| Nukuna, Nagella | DuPont Electronics Corporation | DuPont’s holistic approach in advancing CMP/PCMP technology |
| Philipossian, Ara | Araca and 3M | Tribological, Thermal, Kinetic, and Surface Microtextural Characterization of Prime p-Type <100> Silicon Wafer CMP using Advanced Microreplicated Pads for Direct Wafer Bonding Application |
| Philipossian, Ara | Araca | Benefits of Novel Megasonic Slurry Activation in Copper CMP |
| Rudolph, Catharina | Fraunhofer IZM-ASSID | Enabling advanced direct bond interconnection with CMP: From R&D to HVM implementation |
| Sanada, Toshiyuki | Shizuoka University | Deformation of PVA Brush Nodules and the Resulting Liquid Flow in Post-CMP Cleaning |
| Seo, Jihoon | Clarkson University | Corrosion Control through Predictive Modeling and Strategic Inhibitor Selection for CMP applications |
| Stomberg, Jaimie | 3M | Developing CMP Pads For Next-Generation Polish Applications |
| Suzuki, Keisuke | Kyushu Institute of Technology | Study on the Removal Method of Nanoparticles Using Cleaning-Assisted Resin Particles |
| Uneda, Michio | Gifu University | Development of Model-based Robot Polishing System |
| Wedlake, Michael | IBM | Pad Grooves & Tire Treads: Why Are We Not Systematically Measuring Them? |
| Zhang, Baoguo | Hebei University of Technology | Explore the Roles and Mechanisms of Green Organic Additives in GaN CMP |
| Zhang, Brian | Applied Materials | Modeling of Fluid Dynamics in CMP |
Download a PDF of the speaker list here. The final schedule will be released in early July.
(note that oral papers are invitation only)
2025 CAMP CMP Symposium Sponsors
We are grateful to the following sponsors!
Platinum sponsors
Gold sponsors
If your organization is interested in becoming a sponsor, please contact CAMP’s Business Development Director, Eric Xu, at zxu@clarkson.edu.
Draft Schedule (subject to change)
SUNDAY, July 27, 2025
1:00 pm – 5:00 pm Registration & Hotel Check-In
5:00 pm – 6:00 pm Welcome Reception
MONDAY, July 28
7:00 am – 8:00 am Breakfast
8:00 am – 9:50 am SESSION A (Includes Plenary Speaker 1)
9:50 am – 10:15 am Break (25 min)
10:15 am – 12:00 am SESSION B
12:00 pm – 1:30 pm Lunch
1:30 pm – 4:00 pm Open Time
4:00 pm – 5:30 pm SESSION C
5:40 pm – 7:00 pm Poster Session (for students) and Reception
7:00 pm – late Dinner (on own)
TUESDAY, July 29
7:00 am – 8:10 am Breakfast
8:10 am – 9:50 am SESSION D (Includes Plenary Speaker 2)
9:50 am – 10:15 am Break (25 min)
10:15 am – 12:00 pm SESSION E
12:00 pm – 1:30 pm Lunch
1:30 pm – 4:00 pm Open Time
2:00 pm – 4:00 pm Panel for Students: Topic TBA.
4:00 pm – 5:40 pm SESSION F
5:40 pm – 6:30 pm Reception
6:30 pm – 8:30 pm 2025 International CMP Symposium Dinner & Keynote Address
WEDNESDAY, July 30
7:00 am – 8:30 am Breakfast Buffet
SESSION G: Session Title
8:30 am – 9:50 am SESSION G
9:50 am – 10:15 am Break (25 min)
10:15 am – 12:30 pm SESSION H
12:30 pm – 1:30 pm Lunch & Depart
Registration Refund Policy
Full refund if request is made to the CAMP office by 11:59 pm (US EST) on July 11, 2025. 33% refund if request is made from July 12 – 26, 2025. No refund after July 26, 2025. Hotel payments/refunds are only handled between the attendee and the hotel.
Find out more about CAMP at our main website: https://www.clarkson.edu/academics/research/labs-centers/camp
Find out more NYSTAR’s Centers of Advanced Technologies (CATs): https://esd.ny.gov/doing-business-ny/centers-advanced-technology
To learn more about the Northern California Chapter of the American Vacuum Society (NCCAVS) CMP Users Group, visit: https://nccavs-usergroups.avs.org/about_cmpug/
