2021 CAMP CMP Symposium

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Clarkson University’s Center for Advanced Materials Processing (CAMP) and the NCCAVS CMP Users Group invites you to attend the 24th International Symposium on Chemical-Mechanical Planarization.

24th International Symposium on Chemical-Mechanical Planarization​

Monday, August 16 – Thursday, August 19, 2021
The meeting will be held online

Chemical-mechanical planarization has come to occupy a central role in many industrially important technologies. This year due to the pandemic, the symposium will be held in a virtual Gordon Research Conference format and will focus on several fundamental aspects of chemical-mechanical planarization including:

  • Particle and colloidal aspects
  • Slurry development and metrology
  • Pad/ conditioning behaviors
  • CMP of
    • STI, SiN/ Poly, etc.
    • W, Cu, Co, etc
    • Substrate materials (e.g., SiC, Si, GaN, InP, Al2O3, Glass, etc.)
    • Alternate thin films (e.g., noble metals, polymers, etc.)
  • CMP of III/V metals and new barrier materials
  • CMP fundamental science and technology
  • Defects and post-CMP cleaning
  • Low-k films and integration issues
  • Micro LEDs/ MEMS/ SOI polishing
  • Other emerging applications of CMP

Invited Speakers from end users, tool, pad and slurry manufacturers, and Universities will present their recent research results.  There will be a virtual poster session organized.

Check back regularly for updates, including speaker list, registration, and poster abstract submission details.

FOR MORE INFORMATION: Please contact Leila Boyea, Clarkson University, CAMP at 315-268-2336 or lboyea@clarkson.edu.