{"id":689,"date":"2024-01-02T18:19:14","date_gmt":"2024-01-02T18:19:14","guid":{"rendered":"https:\/\/dev-cu-sites.pantheonsite.io\/camp\/?page_id=689"},"modified":"2024-08-20T13:08:12","modified_gmt":"2024-08-20T13:08:12","slug":"2024-camp-international-cmp-symposium","status":"publish","type":"page","link":"https:\/\/sites.clarkson.edu\/camp\/2024-camp-international-cmp-symposium\/","title":{"rendered":"2024 CAMP International CMP Symposium"},"content":{"rendered":"

Clarkson University’s Center for Advanced Materials Processing (CAMP) hosted the 26th International Symposium on Chemical Mechanical Planarization (CMP)<\/strong><\/em> in Lake Placid, NY, from August 11 – 14, 2024.\u00a0<\/h3>\n

\t\t\t\t\t\t\t\t\t\t\t\t\t\"CAMP\t\t\t\t\t\t\t\t\t\t\t\t\t<\/p>\n

Chemical-mechanical planarization (CMP) <\/strong>plays a central role in many industrially important technologies, especially in semiconductor manufacturing. The 26th International Symposium on CMP<\/i><\/b> is a leading forum to hear leading-edge ideas and technologies relating to CMP along with ample time to network with colleagues in the CMP field. Presentations are by invitation only which ensures a very high-quality meeting. <\/p>\n

FINAL Schedule Available! See below…<\/h2>\n

The symposium featured the following special guest speakers:<\/b><\/p>\n

\t\t\t\t\t\t\t\t\t\t\t\t\t\"Vidya\t\t\t\t\t\t\t\t\t\t\t\t\t<\/p>\n

Vidya Krishnan<\/strong>\u00a0<\/h4>\n
Vice President of Global Operations at GlobalFoundries<\/h5>\n
Keynote Speaker<\/b><\/i> during conference dinner (Aug. 13)<\/h5>\n

“Operational Journey Through Time: How Digitization has Transformed Manufacturing Operations”<\/p>\n

\t\t\t\t\t\t\t\t\t\t\t\t\t\"JiChulYang\"\t\t\t\t\t\t\t\t\t\t\t\t\t<\/p>\n

Ji-Chul Yang<\/strong><\/h5>\n
General Manager & Head of R&D at EBARA Corp.<\/h5>\n
Plenary Speaker<\/i><\/b><\/h5>\n

“Images of the Planarization Process in Semiconductor Devices in 2030”<\/p>\n

\t\t\t\t\t\t\t\t\t\t\t\t\t\"Brown\t\t\t\t\t\t\t\t\t\t\t\t\t<\/p>\n

Brown Peethala<\/strong><\/h4>\n
Senior Manager, CMP Process at IBM<\/h5>\n
Plenary Speaker<\/b><\/i><\/h5>\n

“Process Innovations for Advanced Logic Technology”<\/p>\n

Some photos from the symposium:<\/h2>\n

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*** Updated FINAL Schedule & Abstract Booklet Available ***<\/h2>\n

The final schedule and abstract booklet for the 2024 CAMP CMP Symposium is available as a PDF.\u00a0<\/p>\n

Please note this version is as of 8\u00a0August 2024<\/b>\u00a0but is subject to change.<\/p>\n

Please contact Leila Boyea<\/a> if you need the agenda emailed to you.\u00a0<\/p>\n

\t\t\t
\n\t\t\t\t\t\tFinal Schedule\/Abstracts – Click Here
\n\t\t\t\t\t<\/a><\/p>\n

Invited Speakers:<\/h2>\n
Uma Rames Krishna Lagudu<\/b> (3M)
“Pad Conditioning Solutions for Improved Pad Life and Defectivity”\u00a0<\/h6>\n
Kangchun Lee<\/b> (Kyonggi University)
“Predicting Corrosion Inhibition Efficiency Based on Charge Transfer Factor”<\/h6>\n
Leticia Vazquez Bengochea<\/b> (Micron)
“How CMP Will Enable and Accelerate the Advanced Memory Roadmap”<\/h6>\n
Syuhei Kurokawa<\/b> (Kyushu University)
“Observation\u00a0of slurry particle behavior at the polishing pad-wafer contact interface and proposal of a new pad-wafer contact model for understanding CMP mechanism”<\/h6>\n
Norikazu Suzuki<\/b> (Chuo University)
“Towards an Advanced Process Control of Chemical Mechanical Polishing Utilizing Physical Model-based Digital Twin”<\/h6>\n
Yohei Hashimoto<\/b> (Kanazawa University)
“Analysis of Material Removal Rate Distribution in Oxide CMP Process Using Stop-polishing Approach”<\/h6>\n
Hideo Aida<\/b> (Nagaoka Univ. of Technology)
“Development of Plasma-CMP Technique for Hard-to-process Semiconductor Materials”<\/h6>\n
Yasuhiro Kawase<\/b> (Mitsubishi Chemical Corp.)
“Semiconductor Cleaning: Fundamentals and Technology Trends in Post-CMP Cleaning”<\/h6>\n
Seokgyu Ryu<\/b> (Clarkson University)
“Advancing Molybdenum CMP: Understanding Inhibition Mechanism of Environmentally Friendly Amino Acids via Passivation Layer Analysis”<\/h6>\n
John Matovu <\/b>(Micron)
“Challenges and Opportunities of Using Engineered High Oxide Rate Slurries (HORS) for Scratch Reduction and Removal Rate Improvement”<\/h6>\n
Jakub Nalaskowski<\/b> (NYCREATES)
“Chemical Mechanical Planarization for Superconducting Quantum Devices Development”<\/h6>\n
Seunghoon Choi<\/strong> (Samsung)
“Tailored Electrostatic Attraction Force Between Anionic Polymer and Si3N4 Film in Consecutive Gate Poly Open CMP”<\/h6>\n
Myunggoo Lee<\/b> (KCTech)
“Surface chemistry of Ceria for CMP”<\/h6>\n
Ravi Palaparthi<\/b> (DuPont)
“Wafer Edge Profile and Control during CMP”<\/h6>\n
Yi Guo<\/b> (DuPont)
“Exploration of Tungsten and MOL Slurry Building-Blocks for Advanced Node CMP Processes”<\/h6>\n
Pinlei Chu<\/b> (IBM)
“Tungsten dissolution in MOL-Root Cause Investigation”<\/h6>\n
Dan Troolin<\/b> (TSI)
“High-Resolution Size Distribution Characterization of CMP Slurry Particles”<\/h6>\n
Badri Bhattarai <\/b>(EMD Group)
“Copper CMP Slurry Development for Advanced Technology Nodes”<\/h6>\n
Hanchul Cho, Doyeon Kim, Taekyung Lee, Hyoungjae Kim<\/b> (Korea Institute of Industrial Technology)
“Breaking Boundaries: Recipe-Free Innovation in CMP Pad Conditioning”<\/h6>\n
Cetin Cetinkaya<\/b> (Clarkson University)
“Nano\/Micro-Particle Adhesion and Removal”<\/h6>\n
Atanu Das<\/b> (Entegris)
“Integrated Approaches of Designing Better PCMP Cleaning Formulations”<\/h6>\n
Taesung Kim<\/strong> (SKKU)
“Investigation of Thermal Effects in Chemical Mechanical Planarization (CMP)”<\/h6>\n
Christoper Netzband<\/strong> (TEL)
“Planarization Challenges for Current and Future 3D Integration Technologies”<\/h6>\n
Rob Rhoades\u00a0<\/strong> (XTrinSiC)
“Methods for Characterizing Slurry Health and Why it Matters”<\/h6>\n
Francois Laforge\u00a0<\/strong> (Horiba)
“Simultaneous Live Monitoring of Multiple Additives Concentration with a Flow Cell Raman Spectroscopy System”<\/h6>\n
Jason Keleher\u00a0<\/strong> (Lewis University)
“\u201cStimuli-Responsive\u201d Chemistries for Low-Stress SiC p-CMP Cleaning Processes”<\/h6>\n
Sunghoon Lee\u00a0<\/strong> (KCTech)
“The Future of Ceria Slurry: Selectivity, Planarization and Defect”<\/h6>\n

Please note that oral presentations are by invitation only.\u00a0<\/p>\n

Master Schedule<\/h2>\n

Below is an outline of the symposium schedule.<\/p>\n

Each Session will consist of 4-5 talks (most 25 mins except the two plenaries and the keynote). Topics include: CMP Applications, CMP Pads and Conditioners, CMP Slurries, Post-CMP Cleaning, Advances in CMP Tools, CMP of Novel Materials.<\/p>\n

SUNDAY, AUGUST 11<\/u><\/strong><\/p>\n

1:00 pm \u2013 5:00 pm\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0 Registration & Hotel Check-In (Hotel Lobby<\/em>)<\/p>\n

5:00 pm \u2013 6:00 pm\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0 Welcome Reception (Sentinel Range<\/em>)<\/p>\n

MONDAY, AUGUST 12<\/u><\/strong>\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0 All presentations will be held in\u00a0McIntyre Range<\/em><\/p>\n

7:00 am \u2013 8:00 am\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0Breakfast (Great Range)<\/em><\/p>\n

8:00 am \u2013 9:50 am \u00a0 \u00a0 \u00a0 \u00a0\u00a0SESSION A: <\/strong>(Includes Plenary Speaker 1)<\/p>\n

9:50 am \u2013 10:15 am\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0Break<\/em>\u00a0(25 min)<\/p>\n

10:15 am \u2013 12:00 am \u00a0 \u00a0\u00a0SESSION B:<\/strong><\/p>\n

12:00 pm \u2013 1:30 pm\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0Lunch (Great Range)<\/em><\/p>\n

1:30 pm \u2013 4:00 pm\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0Open Time<\/em><\/p>\n

4:00 pm \u2013 5:30 pm \u00a0 \u00a0 \u00a0 \u00a0\u00a0SESSION C:<\/strong><\/p>\n

5:40 pm \u2013 7:00 pm\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0Poster Session and Reception (Sentinel Range)<\/em><\/p>\n

7:00 pm \u2013 late \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0Dinner on your own. There are many excellent restaurants in Lake Placid to choose from.\u00a0<\/p>\n

TUESDAY, AUGUST 13<\/u><\/strong><\/p>\n

7:00 am \u2013 8:10 am\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0Breakfast Buffet (Great Range)<\/em><\/p>\n

8:10 am \u2013 9:50 am \u00a0 \u00a0 \u00a0 \u00a0\u00a0SESSION D: <\/strong>(Includes Plenary Speaker 2)<\/p>\n

9:50 am \u2013 10:15 am\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0Break<\/em>\u00a0(25 min)<\/p>\n

10:15 am \u2013 12:00 pm\u00a0\u00a0\u00a0\u00a0\u00a0SESSION E: Title<\/strong><\/p>\n

12:00 pm \u2013 1:30 pm\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0Lunch (Great Range)<\/em><\/p>\n

1:30 pm \u2013 4:00 pm\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0Open Time<\/em><\/p>\n

2:00 pm \u2013 4:00 pm \u00a0\u00a0\u00a0\u00a0\u00a0\u00a0 Panel for Students: From Rough to Ready: Protecting Your CMP Innovations
Through IP, Led by Tricia Burroughs, GlobalFoundries (optional)<\/em><\/p>\n

4:00 pm \u2013 5:40 pm \u00a0 \u00a0 \u00a0 \u00a0\u00a0SESSION F:<\/strong><\/p>\n

5:40 pm \u2013 6:30 pm\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0Reception (Sentinel Range)<\/em><\/p>\n

6:30 pm \u2013 8:30 pm\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a02024 International CMP Symposium: Dinner & Keynote Address\u00a0<\/strong>(Great Range).
<\/em>\u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 Vidya Krishnan<\/strong>, VP for Global Operations, GlobalFoundries.\u00a0<\/p>\n

WEDNESDAY, AUGUST 14<\/u><\/strong><\/p>\n

7:00 am \u2013 8:30 am\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0Breakfast Buffet<\/em><\/p>\n

SESSION G: Session Title<\/strong><\/p>\n

8:10 am \u2013 9:50 am \u00a0 \u00a0 \u00a0 \u00a0\u00a0SESSION G:<\/strong><\/p>\n

9:50 am \u2013 10:15 am\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0Break<\/em>\u00a0(25 min)<\/p>\n

10:15 am \u2013 12:30 pm \u00a0 \u00a0\u00a0SESSION H:<\/strong><\/p>\n

12:30 pm \u2013 1:30 pm\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0Lunch\u00a0<\/strong>(Great Range)\u00a0<\/em>& Depart<\/strong><\/p>\n

Student Posters<\/h2>\n

We have a student poster session on Monday afternoon of the 26th International Symposium on Chemical-Mechanical Planarization.<\/strong><\/p>\n

The goal of the poster session is to provide an opportunity to network, learn about each other\u2019s work and interests, and meet academic and industrial colleagues for future collaborative research.\u00a0<\/p>\n

\u00a0<\/p>\n

How to get to Lake Placid?<\/h3>\n

The following website has information on how to get to Lake Placid:<\/p>\n

(https:\/\/www.lakeplacid.com\/explore\/getting-here<\/a>)<\/p>\n

While there is a small regional\u00a0airport close by that has flights to\/from Boston,\u00a0planes are small and can be bumpy \ud83d\ude41\u00a0<\/p>\n

The closest international airport is Albany NY (the NY State capitol). If you choose to fly into Albany, rent a car and\u00a0then enjoy the 2.5 hour\u00a0drive\u00a0through\u00a0the picturesque Adirondacks.\u00a0<\/p>\n","protected":false},"excerpt":{"rendered":"

Clarkson University’s Center for Advanced Materials Processing (CAMP) hosted the 26th International Symposium on Chemical Mechanical Planarization (CMP) in Lake Placid, NY, from August 11 – 14, 2024.\u00a0 Chemical-mechanical planarization (CMP) plays a central role in many industrially important technologies, especially in semiconductor manufacturing. The 26th International Symposium on CMP is a leading forum to hear leading-edge […]<\/p>\n","protected":false},"author":1,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"advgb_blocks_editor_width":"","advgb_blocks_columns_visual_guide":"","footnotes":""},"class_list":["post-689","page","type-page","status-publish","hentry"],"coauthors":[],"author_meta":{"author_link":"https:\/\/sites.clarkson.edu\/camp\/author\/moeler\/","display_name":"moeler"},"relative_dates":{"created":"Posted 2 years ago","modified":"Updated 2 years ago"},"absolute_dates":{"created":"Posted on January 2, 2024","modified":"Updated on August 20, 2024"},"absolute_dates_time":{"created":"Posted on January 2, 2024 6:19 pm","modified":"Updated on August 20, 2024 1:08 pm"},"featured_img_caption":"","featured_img":false,"series_order":"","_links":{"self":[{"href":"https:\/\/sites.clarkson.edu\/camp\/wp-json\/wp\/v2\/pages\/689","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/sites.clarkson.edu\/camp\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/sites.clarkson.edu\/camp\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/sites.clarkson.edu\/camp\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/sites.clarkson.edu\/camp\/wp-json\/wp\/v2\/comments?post=689"}],"version-history":[{"count":0,"href":"https:\/\/sites.clarkson.edu\/camp\/wp-json\/wp\/v2\/pages\/689\/revisions"}],"wp:attachment":[{"href":"https:\/\/sites.clarkson.edu\/camp\/wp-json\/wp\/v2\/media?parent=689"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}