{"id":483,"date":"2022-11-21T15:34:17","date_gmt":"2022-11-21T15:34:17","guid":{"rendered":"https:\/\/dev-cu-sites.pantheonsite.io\/camp\/?page_id=483"},"modified":"2023-08-02T12:34:11","modified_gmt":"2023-08-02T12:34:11","slug":"25th-international-symposium-on-cmp","status":"publish","type":"page","link":"https:\/\/sites.clarkson.edu\/camp\/25th-international-symposium-on-cmp\/","title":{"rendered":"25th International Symposium on CMP"},"content":{"rendered":"

CAMP is excited to host the 25th International Symposium on Chemical-Mechanical Planarization (CMP)<\/p>\n

August 6 – 9, 2023 in Lake Placid, NY<\/h2>\n

\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\"\"\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/p>\n

Chemical-mechanical planarization (CMP)\u00a0<\/strong>has come to occupy a central role in many industrially important technologies, especially in semiconductor manufacturing.\u00a0The 25th International Symposium on CMP<\/i><\/b>, hosted by Clarkson University\u2019s Center for Advanced Materials Processing (CAMP)<\/b>, is the leading forum to\u00a0hear leading-edge ideas and technologies relating to CMP along with ample time to network with colleagues in the CMP field.<\/p>\n

The meeting will again be held in picturesque Lake Placid, New York, in the\u00a0High Peaks\u00a0Resort Hotel.\u00a0<\/p>\n

Hotel and travel information can be found further below.\u00a0<\/p>\n

\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\"\"\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/p>\n

Schedule Announced!\u00a0<\/b><\/h3>\n

We are pleased to announce the\u00a0schedule of talks – see below\u00a0<\/b>(updated 8\/2\/2023).<\/p>\n

SUNDAY, AUGUST 6<\/u><\/strong><\/p>\n

1:00 pm \u2013 5:00 pm\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0 Registration & Hotel Check-In (Hotel Lobby<\/em>)<\/p>\n

5:00 pm \u2013 6:00 pm\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0 Welcome Reception (Sentinel Range<\/em>)<\/p>\n

MONDAY, AUGUST 7<\/u><\/strong> \u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0 All presentations will be held in McIntyre Range<\/em><\/p>\n

7:00 am \u2013 8:00 am\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0 Breakfast (Great Range)<\/em><\/p>\n

SESSION A: \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 <\/strong>Chair: Bob Roberts<\/strong> (X-trinSiC)<\/p>\n

8:00 am \u2013 8:10 am\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0 Opening Remarks<\/em> Devon A. Shipp<\/strong>, Clarkson University<\/p>\n

8:10 am \u2013 9:00 am\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0 Plenary:<\/strong> CMP Challenges and Equipment Solutions for FEOL Applications, <\/em>Katrina Mikhaylichenko<\/strong>, Applied Materials<\/p>\n

9:00 am \u2013 9:25 am\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0 CMP Opportunities for Emerging Semiconductor Technologies, <\/em>Thomas Hoff<\/strong>, Intel Corporation<\/p>\n

9:25 am \u2013 9:50 am\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0 Nodule Deformation and Contact Path of PVA Roller Brushes on a Rotating Plate, <\/em>Toshiyuki Sanada<\/strong>, Shizuoka University<\/p>\n

9:50 am \u2013 10:15 am\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0 Break<\/em> (25 min)<\/p>\n

SESSION B:\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0 <\/strong>Chair: Thomas Hoff<\/strong> (Intel)<\/p>\n

10:15 am \u2013 10:40 am\u00a0\u00a0\u00a0\u00a0 Characterization of PVA Brush in Post-CMP Cleaning for 10nm Below Metal CMP Process<\/em>, Jingoo Park<\/strong>, Hanyang University<\/p>\n

10:40 am \u2013 11:05 am\u00a0\u00a0\u00a0\u00a0 Corrosion Management and Cleaning of Very Small Features Following CMP of Advanced Logic Devices, <\/em>Paul Bernatis<\/strong>, DuPont<\/p>\n

11:05 am \u2013 11:20 am\u00a0\u00a0\u00a0 United States <\/i>CMP Users Group: User Group Activities and Program Status<\/i>, <\/em>Bob Roberts<\/strong>, Chair – United States CMP Users Group<\/p>\n

11:20 am \u2013 12:00 pm\u00a0\u00a0\u00a0\u00a0 Poster Pitches<\/em>, Various<\/p>\n

12:00 pm \u2013 1:30 pm\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0 Lunch (Great Range)<\/em><\/p>\n

1:30 pm \u2013 4:00 pm\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0 Open Time<\/em><\/p>\n

SESSION C:\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0 <\/strong>Chair: Tricia Burroughs<\/strong> (GlobalFoundries)<\/p>\n

4:00 pm \u2013 4:25 pm\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0 Advanced in W CMP Slurries for High Rate and Low Corrosion<\/em>, Na Zhang<\/strong>, Entegris<\/p>\n

4:25 pm \u2013 4:50 pm\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0 The \u201cPER\u201d-fect Storm: Exploring Complex-Assisted Redox Chemistries for Enhanced SiC CMP Performance<\/em>, Jason Keleher<\/strong>, Lewis University<\/p>\n

4:50 pm \u2013 5:15 pm\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0 Cu CMP Center Residue Relationship to Pad Groove Design and Head Oscillation<\/em>,Eric Egan<\/strong>, GlobalFoundries<\/p>\n

5:15 pm \u2013 5:40 pm\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0 Poster Pitches<\/em>, Various<\/p>\n

5:40 pm \u2013 7:00 pm\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0 Poster Session and Reception (Sentinel Range)<\/em><\/p>\n

7:00 pm \u2013 9:00 pm\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0 2023 International CMP Symposium: Dinner & Keynote Address <\/strong>(Great<\/em> Range<\/em>)<\/p>\n

Andy Carswell<\/strong>, Director of DRAM CMP at Micron, The \u201cBond\u201d Between Advanced Memory and CMP has Never Been Stronger \u2013 CMP will Enable the Memory Roadmap<\/em>. Introduced by Marc P. Christensen <\/strong>(President, Clarkson University)<\/p>\n

TUESDAY, AUGUST 8<\/u><\/strong><\/p>\n

7:00 am \u2013 8:30 am\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0 Breakfast Buffet (Great Range)<\/em><\/p>\n

SESSION D:\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0 <\/strong>Chair: Hirokuni Hiyama<\/strong> (Ebara)<\/p>\n

8:10 am \u2013 9:00 am\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0 Plenary:<\/strong> An Overview of Advanced Process Control Solutions for CMP, <\/em>Jun Qian<\/strong>, Applied Materials<\/p>\n

9:00 am \u2013 9:25 am\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0 Slurry Activation for Enhanced Surface Redox Reactions in CMP<\/em>, Ara Philipossian<\/strong>, Araca, Inc.<\/p>\n

9:25 am \u2013 9:50 am\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0 Moving Sub-100 nm Particle on Surface Observatory in Wet Process by Evanescent Wave<\/em>, Panart Khajornrungruang<\/strong>, Kyushu Institute of Technology<\/p>\n

9:50 am \u2013 10:15 am\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0 Break<\/em> (25 min)<\/p>\n

SESSION E:\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0 <\/strong>Chair: Julia Kozhukh<\/strong> (DuPont)<\/p>\n

10:15 am \u2013 10:40 am\u00a0\u00a0\u00a0\u00a0 Environmentally Friendly Amino Acid-based CMP Slurry for Cu and Co<\/em>, Elizabeth Podlaha-Murphy<\/strong>, Clarkson University<\/p>\n

10:40 am \u2013 11:05 am\u00a0\u00a0\u00a0\u00a0 AFM Study on the Hydration of PVA Brush Surface and its Impact on the Interaction with Abrasive Nanoparticle<\/em>, Takeshi Fukuma<\/strong>, Kanazawa University<\/p>\n

11:05 am \u2013 11:30 am\u00a0\u00a0\u00a0\u00a0 Challenges with Utilizing Sonic Energy for post CMP Cleaning Applications<\/em>, Timothy Thao<\/strong>, Applied Materials<\/p>\n

11:30 am \u2013 11:55 am\u00a0\u00a0\u00a0\u00a0 Design and Manufacturing Strategies for Scratch-less Pads in Chemical-Mechanical Polishing<\/em>, Sa<\/strong>nha Kim<\/strong>, KAIST<\/p>\n

12:00 pm \u2013 1:30 pm\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0 Lunch (Great Range)<\/em><\/p>\n

1:30 pm \u2013 4:00 pm\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0 Open Time<\/em><\/p>\n

2:00 pm \u2013 4:00 pm \u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0 Mentoring Workshop, <\/em>Led by Tricia Burroughs<\/strong> (GlobalFoundries)<\/em> (Great Range<\/em>)<\/p>\n

SESSION F:\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0 <\/strong>Chair: Taesung Kim<\/strong> (Sungkyunkwan University)<\/p>\n

4:00 pm \u2013 4:25 pm\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0 W Post CMP Clean Performance with Advanced Formulations<\/em>, Wei-Tsu Tseng<\/strong>, IBM<\/p>\n

4:25 pm \u2013 4:50 pm\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0 Slurry PSD\u2019s and LPC\u2019s: Why Do They Matter?<\/em>, Robert Rhoades<\/strong>, X-trinSiC<\/p>\n

4:50 pm \u2013 5:15 pm\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0 CMP Challengess in Imager and Micro Display Fabrication<\/em>, Knut Gottfried<\/strong>, Fraunhofer ENAS<\/p>\n

5:15 pm \u2013 5:40 pm\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0CMP Sustainability Practices for Water Conservation in a High Volume Manufacturing Environment<\/i>, Elizabeth Anderson<\/strong>, Analog Devices<\/p>\n

5:40 pm \u2013 6:30 pm\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0 Reception (Sentinel Range)<\/em><\/p>\n

6:30 pm \u2013 8:30 pm\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0 2023 International CMP Symposium: Dinner & Keynote Address <\/strong>(Great Range)<\/em><\/p>\n

Hoyoung Kim<\/strong>, Master, Process Development, Semiconductor R&D Center, Samsung Electronics, CMP at 40: Beyond the Hype, Challenges and Opportunities for the Next 10 Years<\/em>. Introduced by Bill Jemison<\/strong> (Dean, Coulter School of Engineering, Clarkson University.<\/p>\n

WEDNESDAY, AUGUST 9<\/u><\/strong><\/p>\n

7:00 am \u2013 8:30 am\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0 Breakfast Buffet<\/em><\/p>\n

SESSION G:\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0 <\/strong>Chair: Bradley Wood<\/strong> (Entegris)<\/p>\n

8:10 am \u2013 8:35 am\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0 Planarization Technology above Chemical Mechanical Polishing, <\/em>JiChul Yang<\/strong>, Ebara<\/p>\n

8:35 am \u2013 9:00 am\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0 Abrasive Size Distribution Control of CMP Slurry by Using Tangential Flow Filtration<\/em>,Taesung Kim<\/strong>, Sungkyunkwan University<\/p>\n

9:00 am \u2013 9:25 am\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0 Modern Nanoparticle Characterization Tools for CMP, <\/em>Jeffrey Bodycomb<\/strong>, HORIBA Instruments Inc.<\/p>\n

9:25 am \u2013 9:50 am\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0 CMP Removal Rate Scaling using the Shear Force Law How to Change the Removal Rate Without Affecting Friction and vice versa<\/em>, Leonard Borucki<\/strong>, Araca, Inc.<\/p>\n

9:50 am \u2013 10:15 am\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0 Break<\/em> (25 min)<\/p>\n

SESSION H:\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0 <\/strong>Chair: Jihoon Seo<\/strong> (Clarkson University)<\/p>\n

10:15 am \u2013 10:40 am\u00a0\u00a0\u00a0\u00a0 Thickness Profile <\/em>Verification on the Time Dependency in FEOL CMP<\/em>, Seungmahn Lee<\/strong>, Samsung Electronics<\/p>\n

10:40 am \u2013 11:05 am\u00a0\u00a0\u00a0\u00a0 Biased Pulse Groove: Efforts Towards Sustainability<\/em>, Jin Kim<\/strong>, DuPont<\/p>\n

11:05 am \u2013 11:30 am\u00a0\u00a0\u00a0\u00a0 Design of Carbon-Based Electrodes for Cu Removal and Recovery from CMP Slurries<\/em>, James Landon<\/strong>, ElectraMet<\/p>\n

11:30 am \u2013 11:55 am\u00a0\u00a0\u00a0\u00a0 SiC vs. Silicon CMP<\/em>, Ian Currier<\/strong>, X-trinSiC<\/p>\n

11:55 am \u2013 12:00 pm\u00a0\u00a0\u00a0\u00a0 Closing Remarks, Devon A. Shipp<\/strong>, Clarkson University<\/p>\n

12:00 pm \u2013 1:30 pm\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0 Lunch <\/strong>(Great Range) <\/em>& Depart<\/strong><\/p>\n

Registration & Accommodation Information<\/h3>\n

Registration is now CLOSED.<\/b>Check-in time is 4pm or after.<\/b>Registration will include 3 breakfasts, 3 lunches, reception food, snacks during breaks, and dinners on Monday and Tuesday nights.\u00a0Our block-booking for accommodation<\/strong>\u00a0at the High Peaks Resort <\/b>is now closed. <\/b>For those who used CAMP’s block-booking: accommodation will be\u00a0paid separately directly to the hotel.
For those who have not made accommodation arrangements: there are several hotels in Lake Placid that you can make reservations at separately.\u00a0\u00a0FYI: the High Peaks Resort can be reached directly at +1-518-523-4411<\/strong>.You can check out the hotel amenities by visiting their website:\u00a0https:\/\/www.highpeaksresort.com<\/a>\u00a0<\/p>\n

A completed tax-exempt form must be presented for tax-exempt status.<\/p>\n

How to get to Lake Placid?<\/h3>\n

The following website has information on how to get to Lake Placid:<\/p>\n

(https:\/\/www.lakeplacid.com\/explore\/getting-here<\/a>)<\/p>\n

While there is a small regional\u00a0airport close by that has flights to\/from Boston,\u00a0planes are small and can be bumpy \ud83d\ude41\u00a0<\/p>\n

The closest international airport is Albany NY (the NY State capitol). If you choose to fly into Albany, rent a car and\u00a0then enjoy the 2.5 hour\u00a0drive\u00a0through\u00a0the picturesque Adirondacks.\u00a0<\/p>\n

Poster Presentations<\/h3>\n

Monday, August 7, 5:40 \u2013 7:00 PM in\u00a0Sentinel Range<\/i><\/b><\/h1>\n

\u00a0<\/p>\n

1. \u00a0\u00a0Surfactant-Mediated Non-Contact Dual Jet Cleaning for Post-CMP Wafer Surface,\u00a0<\/b>Wafi Aziz1<\/sup><\/u>, Takuo Sugioka2<\/sup>, Kazuya Date2<\/sup>, Yasushi Fujii2<\/sup>, Takako Harigae3<\/sup>, Mina Tsujiwaki3<\/sup>, and Jihoon Seo1<\/sup><\/h2>\n

1Department of Chemical and Biomolecular Engineering, Clarkson University, Potsdam, NY,\u00a02<\/sup>Electronics & Environmental Solution Division, NIPPON SHOKUBAI CO., LTD., Osaka, Japan,\u00a03<\/sup>Corporate Research Center, NIPPON SHOKUBAI CO., LTD., Osaka, Japan.<\/h2>\n

2.\u00a0\u00a0\u00a0\u00a0\u00a0Post-CMP Cleaning of Non-Spherical Abrasives Charged by Ion Spray or Carrying TRIBOELECTRIC CHARGES,\u00a0<\/b>Abbas Khanmohammadi<\/u>, Goodarz Ahmadi *
Department of Mechanical and Aerospace Engineering, Clarkson University, POTSDAM, NY, 13699, USA.<\/p>\n

3.\u00a0\u00a0\u00a0\u00a0\u00a0Robust\u00a0Sustainability\u00a0Analysis of CMP Consumable Manufacturing,\u00a0<\/b>Ravitej Venkataswamy<\/u>1<\/sup>, Lyle Trimble1<\/sup>, Andrew McDonald2<\/sup>, Douglas Nevers3<\/sup>, Leticia Vazquez Bengochea2<\/sup>, Andrew Carswell2<\/sup>, Alan Rossner4<\/sup>\u00a0and\u00a0\u00a0Jihoon Seo1<\/sup>*
1<\/sup>Department of Chemical & Biomolecular Engineering, Clarkson University, Potsdam, NY,\u00a0USA.
2<\/sup>DRAM CMP, Micron Technology Inc, Boise, ID,\u00a0USA.
3<\/sup>NAND CMP, Micron Technology Inc, Boise, ID,\u00a0USA.
4<\/sup>Institute for a Sustainable Environment, Clarkson University, Potsdam, NY, USA.<\/p>\n

4.\u00a0\u00a0\u00a0\u00a0\u00a0Toward Minimizing Ceria-Related Defects: An In-Depth Analysis of Ceria Removal Models and Their Associated Defects During Brush Scrubbing,\u00a0<\/b>Van-Tuan Nguyen<\/u>1<\/sup>, James Wait2<\/sup>, Tomoya Nishi3<\/sup>, Satomi Hamada3<\/sup>, Hirokuni Himaya3<\/sup>, and Jihoon Seo1<\/sup>, USA,\u00a0
1\u00a0<\/sup>Department of Chemical and Biomolecular Engineering, Clarkson University, Potsdam, NY,
2\u00a0<\/sup>Department of Physics, Clarkson University, Potsdam, NY, USA,\u00a03<\/sup>\u00a0EBARA Corporation, Fujisawa, Kanagawa 251-8502, Japan.<\/p>\n

5.\u00a0\u00a0\u00a0\u00a0\u00a0Environmentally Friendly Semiconductor Cleaning Solutions<\/b>,\u00a0Takako Harigae1<\/sup>, Mina Tsujiwaki1<\/sup>, Takuya Kamiyama1<\/sup>,\u00a0Kazuya Date2<\/sup>, Yasushi Fujii2<\/sup>,\u00a0Takuo Sugioka<\/u>*2<\/sup>
1\u00a0<\/sup>Corporate Research Center, NIPPON SHOKUBAI Co., Ltd., Osaka\u00a0JAPAN,
2\u00a0<\/sup>Electronics & Environmental Solutions Division, NIPPON SHOKUBAI Co., Ltd., Osaka JAPAN.<\/p>\n

6.\u00a0\u00a0\u00a0\u00a0\u00a0Examining Leucine as an Environmentally Friendly Corrosion Inhibitor for Cu and Co Chemical-Mechanical Planarization (CMP),<\/b>\u00a0Hoang Tran Thi Thuy<\/u>, Juster Gichovi, Jihoon Seo and Elizabeth Podlaha,
Department of Chemical and Biomolecular Engineering, Clarkson University, Potsdam, New York,\u00a0USA.<\/p>\n

7.\u00a0\u00a0\u00a0\u00a0\u00a0Sustainable Photoactive Nanocatalysts<\/b>,\u00a0Chathura Wijethunga<\/u>\u00a0and Melissa King, Clarkson University, Potsdam, NY 13699, USA.\u00a0<\/p>\n

8.\u00a0\u00a0\u00a0\u00a0\u00a0Mechanisms of Material Removal for Molybdenum CMP Examined in the Tribo-Electrochemical Approach using Citrate and Percarbonate as Surface Modifiers,\u00a0<\/b>Kassapa Gamagedara<\/u>\u00a0and Dipankar Roy*,\u00a0<\/p>\n

Department of Physics, Clarkson University, Potsdam, New York 13699-5820,\u00a0USA.<\/p>\n

9.\u00a0\u00a0\u00a0\u00a0\u00a0Alternative Chemistries for SiC-CMP Slurry Formulations,\u00a0<\/b>Joseph L. Powell<\/u>, Heather Kamuda, and Jason J. Keleher*,
Department of Chemistry, Lewis University, Romeoville IL, 60446,\u00a0USA.<\/p>\n

10.\u00a0\u00a0Utilizing Megasonic Energy to Induce Chemically Active Low Shear Environments for Silicon Carbide (SiC) Cleaning,\u00a0<\/b>Adam T. Caridi<\/u>, Joseph L. Powell, Piper A. Smith, Jason J. Keleher*, Department of Chemistry, Lewis University, Romeoville IL, 60446,\u00a0USA.<\/p>\n

11.\u00a0\u00a0Stimuli Responsive Chemistry for Cu Enhanced Chemical Mechanical Planarization (CMP) Performance,\u00a0<\/b>Tatiana R. Cahue<\/u>, Kiana A. Cahue, Adam T. Caridi, Ara Philipossian, Yasa Sampurno, Jason J. Keleher*,
Department of Chemistry, Lewis University, Romeoville IL, 60446,\u00a0USA.<\/p>\n

12.\u00a0\u00a0Developing an Amine-Based Chemistry for Shallow Trench Isolation Post-CMP Cleaning,\u00a0<\/b>Kevin R. Reyes<\/u>, Nicole L. Courtenay, Ulysses I. Flores, and Jason J. Keleher*,
Department of Chemistry, Lewis University, Romeoville IL, 60446, USA.<\/p>\n

13.\u00a0\u00a0The Influence of Pad Micro-Feature Design on Chemical Mechanical Polishing (CMP) Performance: Insights from Computational Fluid Dynamics (CFD),\u00a0<\/b>Atefeh Sadri Mofakham<\/u>1<\/sup>,\u00a0Hanchul Cho2<\/sup>, Hyongjae Kim2<\/sup>, Goodarz Ahmadi3<\/sup>\u00a0and Jihoon Seo1<\/sup>,
<\/sub>1<\/sup>Department of Chemical and Biomolecular Engineering, Clarkson University, Potsdam, NY, USA,\u00a02<\/sup>KITECH, Dongnam Division, Precision Mechanical Process and Control R&D group, Principal Researcher, Busan, Republic of Korea,
3<\/sup>\u00a0Department of Mechanical and Aerospace Engineering, Clarkson University, Potsdam, NY, USA.<\/p>\n

14.\u00a0\u00a0Application of Computational Fluid Dynamics for Predicting Chemical Mechanical Planarization Performance in Fabrication Processes,\u00a0<\/b>Atefeh Sadri Mofakham1<\/sup><\/u>, Jihoon Seo1<\/sup>\u00a0and Goodarz Ahmadi2<\/sup>,
1<\/sup>Department of Chemical and Biomolecular Engineering, Clarkson University, Potsdam, NY, USA,\u00a02<\/sup>Department of Mechanical and Aerospace Engineering, Clarkson University, Potsdam, NY, USA.<\/p>\n

15.\u00a0\u00a0Development and Application of a Post-CMP Cleaning Solution Reducing Ceria Contamination,\u00a0<\/b>Katie Gramigna<\/u>, Ping Tzeng, and Paul Bernatis,\u00a0Advanced Cleans Technology, DuPont, NEWARK, DE 19713, USA.<\/p>\n

16.\u00a0\u00a0Novel Polymer Materials: From Surface-Eroding and Recyclable Polyanhydrides to Sustainable and Functional Polyurethanes,\u00a0<\/b>Zinnat Morsada<\/u>, Pooja Yadav, Kashif Ijaz, Arielle Santefort, Ponsubha Sivabalan,\u00a0Harini Gunasekaran<\/u>, Nikunjkumar Visaveliya, Devon A. Shipp*, Department of Chemistry & Biomolecular Science, and Center for Advanced Materials Processing, Clarkson University, Potsdam NY 13699, USA.\u00a0<\/p>\n

\n<\/p>\n","protected":false},"excerpt":{"rendered":"

CAMP is excited to host the 25th International Symposium on Chemical-Mechanical Planarization (CMP) August 6 – 9, 2023 in Lake Placid, NY Chemical-mechanical planarization (CMP)\u00a0has come to occupy a central role in many industrially important technologies, especially in semiconductor manufacturing.\u00a0The 25th International Symposium on CMP, hosted by Clarkson University\u2019s Center for Advanced Materials Processing (CAMP), […]<\/p>\n","protected":false},"author":146,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"advgb_blocks_editor_width":"","advgb_blocks_columns_visual_guide":"","footnotes":""},"class_list":["post-483","page","type-page","status-publish","hentry"],"coauthors":[],"author_meta":{"author_link":"https:\/\/sites.clarkson.edu\/camp\/author\/dshipp\/","display_name":"dshipp"},"relative_dates":{"created":"Posted 3 years ago","modified":"Updated 3 years ago"},"absolute_dates":{"created":"Posted on November 21, 2022","modified":"Updated on August 2, 2023"},"absolute_dates_time":{"created":"Posted on November 21, 2022 3:34 pm","modified":"Updated on August 2, 2023 12:34 pm"},"featured_img_caption":"","featured_img":false,"series_order":"","_links":{"self":[{"href":"https:\/\/sites.clarkson.edu\/camp\/wp-json\/wp\/v2\/pages\/483","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/sites.clarkson.edu\/camp\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/sites.clarkson.edu\/camp\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/sites.clarkson.edu\/camp\/wp-json\/wp\/v2\/users\/146"}],"replies":[{"embeddable":true,"href":"https:\/\/sites.clarkson.edu\/camp\/wp-json\/wp\/v2\/comments?post=483"}],"version-history":[{"count":0,"href":"https:\/\/sites.clarkson.edu\/camp\/wp-json\/wp\/v2\/pages\/483\/revisions"}],"wp:attachment":[{"href":"https:\/\/sites.clarkson.edu\/camp\/wp-json\/wp\/v2\/media?parent=483"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}